Since 1980, the Dr. Tresky AG company has been supplying the micro- and opto- electronics industry with innovative component placers and die bonders.
Over 900 units throughout the world have been installed to meet critical process and placement requirements.
Our worldwide network of distributors provides the technical support for our customers.
Dr. Tresky AG designs and manufacture high quality equipment for :
Die Attach, SMT, Hybrid, MCM, COB, Flip-Chip, Optoelectronic, Microsystemtechnic, and many more...
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